Revolutionary press-packed IGBT technology delivering unmatched power density, reliability, and thermal performance for demanding industrial applications.
While isolated modules are the most commonly used IGBT packages, press-pack devices are favored in applications that require series connection due to their ease of electrical and mechanical stacking, as well as their inherent capability to conduct in a short-circuited state.
Deep-sea offshore wind power flexible direct current transmission and regional power grid flexible direct current interconnection.
Flexible Transmission Converter Valve Capacity：±500kV/2GW
Long-distance UHVDC transmission, regional grid flexible DC interconnection, deep-sea offshore wind power flexible DC transmission, and enhanced grid active support capabilities.
Flexible Transmission Converter Valve Capacity：±800kV/5GW、±500kV/3GW
Long-distance ultra-high voltage direct current transmission and enhanced grid active support capabilities.
Flexible Transmission Converter Valve Capacity：±800kV/8GW
Deep-sea offshore wind power flexible direct current transmission and regional power grid flexible direct current interconnection.
Flexible Transmission Converter Valve Capacity：±500kV/2GW (Compact)
Long-distance UHVDC transmission, regional grid flexible DC interconnection, deep-sea offshore wind power flexible DC transmission, and enhanced grid active support capabilities.
Flexible Transmission Converter Valve Capacity：±800kV/5GW (Compact)、±500kV/3GW (Compact)
Voltage level: ±500kV
Power level: 3000MW
Converter station: Yanqing Converter Station
Voltage level: AC 35kV
Power level: ±(50~150)Mvar
Converter station: Dangxiong and Saga Converter Station
Voltage level: ±300kV
Power level: 2*1500MW
Converter station: Yuezhong Converter Station
Voltage level: ±800kV
Power level: 8000MW
Converter station: Gusu
Converter Station
Our press pack IGBT modules combine cutting-edge semiconductor technology with robust mechanical design to deliver superior performance in the most demanding applications.
Up to 6500V/3000A rating with optimized thermal management for maximum power in compact form factor.
Robust press-pack construction ensures excellent mechanical stability and long-term reliability in harsh environments.
Double-sided cooling capability with direct substrate contact for optimal thermal performance.
Standardized housing dimensions and connection interfaces for seamless system integration.
Choosing HIITIO means choosing a partner dedicated to helping you succeed in your Presspack IGBT project. What sets us apart is not only our expertise, but also our commitment to providing you with value：
Based on the development trends of the semiconductor industry, we conduct technical research on chip technology generations to clear technical barriers for product development.
Based on the needs of different application scenarios, we manage product development along two lines: performance and standard, enhancing product competitiveness in the market.
HIITIO implements comprehensive management. Details are as follows:
We have adopted Huawei's IPD development process and integrated it with the essence of APQP into HIITIO's product development process.
Possess advanced incoming material inspection equipment, which primarily covers material properties of packaging raw materials.
Utilize advanced automated production lines and digital systems to achieve full product traceability, conduct SPC, MSA, and manage abnormality alarms.
Implement a rigorous supply chain management system from the front end to mass production, encompassing supplier research, and quality incident handling.
We hold ISO 9001, IATF 16949, ISO 45001, and ISO 14001 certifications.
HIITIO Semiconductor IGBT packaging and testing line is a leading domestic fully automated, digital power module packaging and testing production line.
Class 1000 clean room(㎡）
Annual production capacity of welded modules (units)
Annual production capacity of press-fit modules（unit）
Yield rate of medium and low voltage products
HIITIO semiconductor power device laboratory covers an area of 2,930 square meters and has a cumulative investment of over 100 million yuan. It includes reliability assessment, failure analysis, and testing capabilities, covering a full range of certification capabilities from 650V to 6500V power devices. It will pass the national CNAS certification in 2023.
Environmental testing; High and low temperature storage; Temperature and humidity fluctuations; Temperature cycling; Hot and cold shock; Salt spray test; Shock test.
Static parameter testing; Dynamic parameter testing; Thermal resistance testing; Temperature rise testing; Ultimate capacity testing; Surge testing; RBSOA testing.
Two-level test evaluation system; Three-level test evaluation system; Reactive power aging test system; Motor application test system; Three-to-three-pair disconnect test platform.
X-ray fluoroscopy; Acoustic scanning; Metallographic microscope; Infrared thermal imaging; Hotspot location; Scanning electron microscope; Parallel short circuit testing;
Power your system with HIITIO Press Pack IGBTs, built for high-power and high-voltage applications. Ideal for HVDC, renewable energy, and industrial drives, HIITIO delivers durability, redundancy, and performance you can trust.
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HIITIO® was established in 2018 as a result of Hecheng Electric introducing a mature R&D team. HIITIO specializes in producing high-voltage DC electrical devices for EV, solar energy systems, and energy storage applications.
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